Microelectronics Packaging Handbook: Semiconductor Packaging

Front Cover
Rao Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Springer Science & Business Media, Jan 31, 1997 - Computers - 1030 pages
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
 

Contents

II11
11-7
CHIPTOPACKAGE INTERCONNECTIONS II129
11-129
Soldering II161
11-161
II295
11-295
II348
11-349
PLASTIC PACKAGING II394
11-394
II454
11-455
POLYMERS IN PACKAGING II509
11-509
THINFILM PACKAGING II624
11-624
Processing II699
11-699
II718
11-718
Computers II730
11-730
PACKAGE ELECTRICAL TESTING II814
11-814
PACKAGE SEALING AND ENCAPSULATION II873
11-873
GLOSSARY AND SYMBOLS II931
11-931
AUTHORS BIOGRAPHIES II977
11-977

Application II518
11-518
II546
11-547

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