Microelectronics Packaging Handbook

adhesion alloy alumina aluminum applications array ball bond bonding braze capacitance ceramic ceramic packages Chapter Chip Carrier coating coefficient conductors connections connector cooling copper corrosion density developed device dielectric constant discussed electrical Electronic Packaging encapsulation epoxy Equation eutectic factor failure fatigue fillers film Flip-Chip flow glass glass-ceramic heat transfer hermetic holes Hybrid IEEE increase Integrated Circuits interconnection interface layer lead frame Leadless Chip Carrier load logic materials mechanical metal module moisture multichip multilayer ceramic noise oxide pads parameters photoresist pins plastic packages plating PLCC polyimide polymer printed-circuit board Proc properties reflow reliability resin sealing semiconductor shown in Figure signal silicon Solder Joint stress structure substrate Surface Mount Surface Mount Technology Table tape techniques temperature terminals thermal conductivity thermal expansion thermal resistance thick-film thickness typical voltage wave soldering wirebonding wiring