Microelectronics Packaging Handbook: Semiconductor PackagingElectronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level. |
Contents
CHIPTOPACKAGE INTERCONNECTIONS II129 | 129 |
Soldering II161 | 161 |
II288 | 288 |
II295 | 295 |
PLASTIC PACKAGING | 398 |
II454 | 455 |
POLYMERS IN PACKAGING II509 | 509 |
Application II518 | 518 |
THINFILM PACKAGING II624 | 624 |
Processing II699 | 699 |
II718 | 718 |
PACKAGE ELECTRICAL TESTING II814 | 814 |
PACKAGE SEALING AND ENCAPSULATION II873 | 873 |
GLOSSARY AND SYMBOLS II931 | 931 |
AUTHORS BIOGRAPHIES II977 | 977 |
| 999 | |
Other editions - View all
Microelectronics Packaging Handbook: Semiconductor Packaging Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein No preview available - 1997 |
Common terms and phrases
adhesion alumina aluminum applications array ball bonding capacitance capacitors ceramic ceramic packages ceramic substrates Chapter chip carriers coating cofired components conductor copper cost cure defects density deposition developed devices dielectric constant electrical Electronic electroplating encapsulant epoxy etching fabrication film Flip Chip function glass glass-ceramic greensheet heat IEEE integrated circuits interconnections layer lead leadframe mainframes manufacturing materials MCM-D mechanical metal Microelectronics moisture molding compound Mullite multichip module multichip packaging multilayer ceramic packaging technology pattern performance photoresist photosensitive photosensitive polyimide pins pitch planarization plastic packages plating polyimide polymer printed wiring board Proc processor properties PSPI reduce reflow reliability resin resistance resistors semiconductor shown in Figure signal silicon single-chip SiO2 solder bumps spin coating stress structure substrate surface Table tape temperature thermal conductivity thermal expansion thickness thin thin-film packaging typical wafer wirebonding
